As Virtual Reality (VR) experiences become increasingly popular, simulating sensory perceptions of environmental conditions is essential for providing an immersive user experience. We present Ambiotherm, a wearable accessory for existing Head Mounted Displays (HMD), which simulates real-world environmental conditions such as ambient temperatures and wind conditions. The system consists of a wearable accessory for the HMD and a mobile application, which generates interactive VR environments and controls the thermal and wind stimuli. The thermal stimulation module is attached to the user’s neck while two fans are focused on the user’s face to simulate wind conditions.
Keywords: Ambient temperature; virtual wind; virtual reality; multimodal interaction.
Ranasinghe, N., Jain, P., Karwita, S., Tolley, D., & Do, E. Y. L. 2017. Ambiotherm: Enhancing Sense of Presence in Virtual Reality by Simulating Real-World Environmental Conditions. In Proceedings of the 35th SIGCHI Conference on Human Factors in Computing Systems (Denver, Colorado, May 6 – 11, 2017). CHI ’17. ACM, New York, NY.
Ranasinghe, N., Jain, P., Tolley, D., Karwita, S., Yilei, S., & Do, E. Y. L. 2016. AmbioTherm: Simulating Ambient Temperatures and Wind Conditions in VR Environments. In Proceedings of the 29th Annual Symposium on User Interface Software and Technology (Tokyo, Japan, October 16 – 19, 2016). UIST ’16. ACM, New York, NY. 85-86.
Ranasinghe, N., Jain, P., Tolley, D., Karwita, S., Yilei, S., & Do, E. Y. L. 2016. AmbioTherm: Simulating Ambient Temperatures and Wind Conditions in VR Environments. US Provisional Patent No. 62/408,319.
InnovFest unBound 2017 / “Ambiotherm” at Marina Bay Sands Convention Centre, Singapore / May 2017.
UIST 2016 / “AmbioTherm: Simulating Ambient Temperatures and Wind Conditions in VR Environments” at Hitotsubashi Hall, National Center of Sciences Building – Tokyo, Japan / October 2016.
This research is supported by the National Research Foundation, Prime Minister’s Office, Singapore under its International Research Centres in Singapore Funding Initiative.